Get ready for the 57th DAC to be held in San Francisco, California, July 19 - 23, 2020. Continuing the tradition of being in the forefront of electronic design, the 57th DAC will offer outstanding training and education as well as superb networking opportunities. Check out www.dac.com.

ASP-DAC 2020 is the 25th annual international conference on VLSI design automation in Asia and South Pacific regions, one of the most active regions of design and fabrication of silicon chips in the world. The conference aims at providing the Asian and South Pacific CAD/DA and Design community with opportunities of presenting recent advances and with forums for future directions in technologies related to Electronic Design Automation (EDA). The format of the meeting intends to cultivate and promote an instructive and productive interchange of ideas among EDA researchers/developers and system/circuit/device designers. All scientists, engineers, and students who are interested in theoretical and practical aspects of VLSI design and design automation are welcomed to ASP-DAC.

General Information

Date: January 13-16, 2020
Place: China National Convention Center (CNCC), Beijing, China
Submission of Papers / Design Descriptions:

• Deadline for submission: 5 PM AOE (Anywhere on Earth) Friday, July 5, 2019
• Notification of acceptance: Monday, September 9, 2019
• Deadline for final version: 5 PM AOE (Anywhere on earth) Monday, November 4, 2019

Registration

Registration to the 25th Asia and South Pacific Design Automation Conference is possible via the ASP-DAC 2020 webpage.

ICCAD is the most well-established CAD conference in the industry. ICCAD has a long standing tradition of producing a cutting-edge, innovative technical program for attendees. 2019 will be no different! November 4-7, 2019, The Westin Westminster, Westminster, CO, US.

ICCAD serves EDA and design professionals, highlighting new challenges and innovative solutions for Integrated Circuit Design Technologies and Systems. ICCAD covers the full range of CAD topics – from device and circuit-level CAD up through system-level CAD and embedded software, as well as CAD for post-CMOS design and novel application areas, such as biology and nanotechnology.